锡膏
Solder Paste

      永安锡膏是用先进超声波雾化工艺自制的低含氧量真圆焊锡粉沫和基于日本先进焊接技术加以自主研发改良的助焊膏配制而成，整个生产均为真空或氮气环境中完成的。具有较高的抗耐塌陷性及良好的印刷性等，适合于细间距印刷，且在印刷后，均可保持长时间的粘著性。
 
Yong An solder paste is made up of solder powder with low oxygen content,high roundness after advanced ultrasonic atomizing processes and soldering flux,independently rsearched and improved process based on the advanced Japanese soldering technology. The entire production is completed under the vacuum or nitrogen gas environment. It has comparatively high collapse resistance and good printabilityetc, so it is adaptable to print at fine pitch and can maintain long-term adhesiveness .

锡膏选用指南
A Guide to the Selection of Solder Paste

* 需用合金成份请参照常用焊锡合金表。
* For the content of alloy, please refer to the table for commonly used solder alloy.
* 本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
* Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.

Mini/Mirco LED 专用锡膏

Mini/Mirco LED Solder Paste

       Micro LED 是指在芯片上集成的高密度微尺寸LED 阵列，每个像素点定址化、单独驱动，具有自发光特性。相比于当前显示技术主流OLED 和LCD，Micro LED 结构更加简单，性能优势更加明显，具有高亮度、低能耗、使用寿命长、无影像烙印、响应速度快等优点。

        Micro LED 作为新一代显示技术，在性能表现上具有诸多优势，但其最大难题“巨量转移”，阻碍了Micro LED量产的进程。Mini LED 是晶粒尺寸约在100 微米以上的LED，相比于Micro LED，制程工艺技术相对容易，生产良率高，具有异性切割特性，并且Mini LED 可采用现有大部分设备进行制造，更容易实现产品量产。

        随着Mini/Mirco LED 的不断发展，元件尺寸不断减少，传统的SMT锡膏锡粉粒径已经不能满足Mini/Mirco LED灯珠的需求。根据“十球规则”，即锡膏印刷时，钢网开孔的间隙，需允许10个锡球通过，否则容易堵网、漏印。因此，对于Mini 或Mirco LED，#6勉强能用，#7合适，#8更好。为此，永安科技开发了Mini /Mirco LED专用超细粉锡膏。

        永安Mini /Mirco LED专用超细粉锡膏，粒径范围为2~6微米，平均4微米，可满足50μm以下Mirco LED 灯珠焊接。

          永安科技Mini /Mirco LED专用超细粉锡膏凭借优异的性能，助力Mini /Mirco LED行业发展。

锡膏使用指南

A Guide to the Operation of Solder Pastes

一、锡膏的储存

I. Storing solder pastes

 A.锡膏应保存在5-10℃环境下，保质期为六个月（从生产日算起）。

B.在使用前，预先将锡膏从冰箱中取出室温下至少4小时，这是为了使锡膏恢复至工作温度，也是为防止水份在锡膏表面冷凝。

A. The solder pastes should be kept under the temperature of 5-10℃ at the shelf life of 6 months (calculated from the date of manufacture).

B. Before operation, first take the solder pastes out of refrigerators and let them stay at a room temperature for at least 4 hours to enable the solder pastes to recover to the operating temperature and also to prevent moisture from surface condensation on solder pastes.

  二、 锡膏搅拌

II. Solder paste mixing

A.为了使锡膏完全地混合均匀，在回温后请充分搅拌锡膏。

B．机器搅拌一般为1~3分钟，人工搅拌一般为3~6分钟（锡膏储存的时间越长，则搅拌时间越长）。

A.In order for solder pastes to be completely mixed in a well distributed manner, after the return of temperature, please adequately mix the solder pastes.

B. The mechanical mixing usually last 1 to 3 minutes, while manual mixing usually lasts 3 to 6 minutes (The longer time the solder pastes are kept, the longer time the mixing requires).

  三、使用环境

III. Operating Environment

锡膏最佳的使用环境：温度为20~25℃，湿度为35~60%。

Optimal operating environment of solder pastes: temperature at 20~25℃, and humidity 35~60%。

四、印刷

IV. Printing

 印刷时锡膏使用注意事项：

A、将锡膏约1/3的量添加于钢网上，并以少量多次的添加方式补足钢网上的锡膏量、以维持锡膏的品质。

B、当天未使用完的锡膏，不可与尚未使用的锡膏共同放置，应另外存放在别的容器中。锡膏开封后在室温下建议于24小时内用完。

C、当天未用完的锡膏，隔天使用时建议将未用完的锡膏与新锡膏以1：2的比例搅拌混合使用，并以少量多次的方式添加使用。

D、锡膏印刷在基板上后，建议于4～6小时内放置元件进入回焊炉。

E、换线超过一小时以上，请于换线前将锡膏从钢网上刮起收入锡膏罐内封盖。

F、尽可能不要接触到皮肤，如接触时请用异丙醇清洗，并且避免吸入挥发之气体。

Cautions in the operation of solder pastes during printing:

A、 Add 1/3 solder pastes on a steel screen by supplementing enough solder pastes in a manner of a small amount in several times to maintain the quality of solder pastes.

B、 For the solder pastes that have not run out, do not place them together with those unused solder pastes. They should be put in other containers. After being unsealed, the solder pastes should be completely used under a room temperature within 24 hours.

C、 For the solder pastes that have not run out the same day, it is recommended that the unused solder pastes on the other day will be mixed with new solder pastes in the ratio of 1:2 for mixing and using, and they will be used in a manner of adding in a small amount in several times.

D、 After solder pastes are printed on substrates, it is recommended that components should be placed into the return solder pots within 4 to 6 hours.

E、 When wire exchange exceeds one hour or more, please scrape the solder pastes up from the steel screen and put it into the solder paste container for sealing.

F、 Try not to make it contact skin. In the case of any such contact, please use isopropanol for rinsing, and try to avoid inhalation of the volatile gases.s

 五、 回流

V. Backflow

 例： SnAgCu 无铅锡膏曲线

Example: Curve of SnAgCu Pb-free Solder Pastes

活化时间：Activating time

加热区：Heating zone

预热区：Preheating zone

时间：Time

回流区：Backflow zone

冷却区：Cooling zone

※其他各产品温度曲线请索阅各锡膏产品规格书。

※ For the curve of temperature of other products, please refer to the specifications of solder paste products.