锡条
Solder Bar

        永安锡条是在使用高纯度金属及严格品管条件下生产而成，在制程中添加抗氧化成份排除焊锡中氧化物之形成， 锡渣的产生率降到最低，永安锡条都符合甚至超越J-STD-006＆JIS-Z-3282AR的标准要求。

Yong An solder bars are generated under the conditions of using high purity metals and rigorous quality controlled by adding anti-oxidant elements in manufacturing processes to remove the oxidants in solders, and the production rate of the solder splash is reduced to the minimum. Yong An solder bars meet and even surpass the requirements of J-STD-006 &JIS-Z-3282AR standards.

常用锡条性能对照表
Contrast of Commonly Used Solder Bars

* 我公司还备有其它成份焊锡供客户选择，请参照常用焊锡合金表。
* Our company also has solders of other contents for the option by clients. Please refer to the Table of Commonly Used Solder Alloy.

常用焊锡合金
Commonly Used Solder Alloy

* 我公司还备有其它成份焊锡供客户选择，详情请向我公司咨询。
* Our company also boasts solders of other contents for the option by clients. For details, please contact us for inquiry.
* 我公司在不同的车间生产有铅制品和无铅制品，并做到每批无铅制品检测符合RoHS＆SS-00259的品质要求方能出库。
*Our company produces lead-free products and lead-containing products in different workshops, and we undertake the inspections and tests of each group of lead-free products which will meet the quality requirements of RoHS＆SS-00259 before they are out of warehouses.

焊锡品质规格（以Sn95.5/Ag3.9/Cu0.6为例）
Solder quality and specifications (taking Sn95.5/Ag3.9/Cu0.6 for example)

* 我公司可为客户提供焊锡杂质分析，提示使用者有关污染物及锡的消耗情况并指出潜在问题。
* Our company can provide solder impurity analysis, remind of relevant contaminants and the consumption of solder and point out the potential problems for user.

锡条使用指南

Guide to the Operation of Solder Bar

一、工作温度

Ⅰ.Operating temperature

Sn-37Pb有铅锡条建议工作温度：250±10℃;无铅锡条建议工作温度：265±10℃。

Recommended operating temperature for Sn-37Pb solder bar: 250±10℃; recommended operating temperature for lead-free solder bar: 265±10℃.

 二、焊料的杂质污染极限

Ⅱ.Limit of impurity contamination of solders 

三、波峰焊接中浮渣的清除

Ⅲ. Clearance of scum in wave soldering

浮渣是形成于焊锡表面的氧化物，其产生的速率是依温度和搅动而定的。温度越高及焊锡表面的搅流越大，形成的浮渣越多。也可添加抗氧化剂而使锡面形成一层保护膜以减少锡的氧化。

Scum is the oxide forming on the surface of solders, its production rate is dependent on temperature and stirring flow. The higher the temperature is ,the bigger the stirring flow of the solder surface is, the more the scum there will be. Also anti-oxidizing agent can be added to form a coat of protective film to reduce.

焊锡表面的氧化物可防止焊锡再氧化，因此，不必经常清除浮渣。只要它不影响波浪的推动，每天清理一次就可以了。也可将锡渣推至一个角落后，在锡渣上加入还原粉再搅拌一下可将大部份锡渣还原为锡。

the oxidation of tin.The oxide on the surface of solders can prevent re-oxidation of solders. Therefore, it is unnecessary to clear scum, as long as it does not affect the forward movement of waves. The splash can also be pushed to one of corners, and reduced powder can be added for stirring once again so that most of splash can be recovered to tin.

 四、波峰焊接中新锡条的添加

Ⅳ. Adding New Solder Bars to Wave Soldering

在波峰焊接过程中，锡的量会不断降低，当降到一定程度时，应及时添加新的锡条。以维持锡的液面而减少因锡波落差大增加锡的氧化。

In the process of wave soldering, the amount of tin will be reduced constantly. When it is reduced to a certain extent, it is necessary to add new solder bars to maintain the liquid surface and to reduce the oxidation of tin due to great difference in decline of solder waves.

五、杂质Cu的清除（有铅），定期检测锡炉中焊锡的成份（无铅）

Ⅴ.Clearance of Impure Cu (lead-containing) and Regular Check of Elements of Solders in Solder Pots (lead-free)

当Cu超过其在Sn中的固溶度之后，Cu与Sn之间将形成金属间化合物，一般为Cu6Sn5，该化合物的熔点在500℃以上，因此它以固态形式存在。这种Cu-Sn之金属间化合物的过多存在将严重影响焊接质量。传统的Sn-Pb焊料比重为8.4，锡化铜杂质Cu6Sn5的比重为8.28。因此在有铅制程中可用“比重法排铜”。即将锡炉温度调低至190℃左右（锡铅焊料此时仍为液态），然后搅动焊料1分钟左右，随后静置8小时以上。由于Cu6Sn5比重比锡铅焊料小，该化合物就会浮于焊料表面，将上层杂质清除即将杂质Cu除去了。可半个月或一个月左右除Cu一次，这样可以减少换槽次数，降低成本。无铅焊料的比重（一般在7.4左右）均比锡化铜的比重小，锡化铜杂质将沉入锅底，固无法像有铅制程用“比重法排铜”去除杂质铜。所以应定期检测锡炉中焊锡的成份，当发现铜及铅接近最高允许标准时，及时更换焊料。依据客户产量的不同，建议1~2个月清炉一次。

When Cu exceeds the solid solubility in Sn, compounds will be formed between the metals of Cu and Sn. Generally, it is Cu6Sn5. The meting point of such a compound is at 500℃ or over. Therefore, it exists in a solid form. The excess existence of compounds between etals of Cu-Sn will severely affect the soldering quality. The conventional weight of Sn-Pb solders is 8.4, the weight of tinned copper Cu6Sn5 impurity is 8.28. Therefore, in the process of lead manufacturing, “weight method copper removal”can be applied, that is, the temperature in soldering pots can be controlled to as low as 190℃ or so (the tin solder is now still in the liquid state), and then mix the solders for about 1 minute. After that, let it lie still for 8 hours or more. As the weight of Cu6Sn5 is lighter than tin solders, such compounds will float on the surface of solders to clear the upper impurities, i.e., to remove the impurities of Cu. Such clearance or removal of Cu can be made once a half month or a month so as to reduce the times of changes in grooves and to reduce costs. The weight of Pb-free solders (generally at 7.4 or so) is lighter than the tinned copper. The impurities of tinned copper will be sunk on the bottom of the pot, so it is unable to remove impure copper in the “removal of copper by the weight method” like the lead manufacturing process. So, it is necessary to regularly test the elements in the solders. When copper and lead is found to approach the maximum allowable standards, it is necessary to replace solders. As the yield as required by clients differs, it is recommended that clearance should be done once a month or every other month.